Introduction
Huawei Technologies reportedly collaborates with Wuhan Xinxin Semiconductor Manufacturing Co. to create high-bandwidth memory (HBM) chips, a crucial component for artificial intelligence (AI) computing infrastructure. Despite Huawei’s denial of this partnership, the move underscores the company’s ongoing efforts to circumvent US technology restrictions.
Key Players and Technology
This development initiative involves several prominent players in China’s semiconductor industry:
Wuhan Xinxin Semiconductor Manufacturing Co.: A subsidiary of Yangtze Memory Technologies Holdings. Jiangsu Changjiang Electronics Tech and Tongfu Microelectronics: These companies will employ advanced packaging technology known as Chip on Wafer on Substrate to stack various semiconductor types, including GPUs and HBM chips, in a single package.
Huawei has denied collaborating with Wuhan Xinxin to develop HBM chips, labeling the information as a “rumor”. Wuhan Xinxin also stated through JZHT (HK) Capital Services that there is no partnership or timeline for such a collaboration.
Strategic Implications
Entering the HBM chip market represents Huawei’s latest strategy to challenge US-imposed technology sanctions. This follows Huawei’s notable return to the 5G smartphone market in August, with the launch of a handset featuring a 7-nanometre processor, a significant achievement that drew both praise in China and scrutiny from Washington.
Progress and Challenges
China is in the early stages of HBM chip development. However, advancements in this area are anticipated to be closely monitored by analysts due to ongoing US semiconductor and AI restrictions.
Industry Developments
In May, a report from Reuters indicated that ChangXin Memory Technologies, China’s leading dynamic random access memory maker, had created sample HBM chips in partnership with Tongfu Microelectronics. Additionally, in April, online tech publication The Information revealed that a consortium of Chinese firms, led by Huawei, aims to boost domestic HBM chip production by 2026.
