In a significant move for the semiconductor industry, Tessolve, a leading provider of semiconductor engineering solutions, has announced a strategic collaboration with Keysight Technologies. This partnership marks a pivotal step forward in expediting the time-to-market for high-speed designs, leveraging the capabilities of Tessolve’s recently launched High-Speed Input/Output (HSIO) Lab. This collaboration promises to bring about enhanced testing capabilities that will substantially improve device performance in challenging applications.
The HSIO Lab: A Catalyst for Semiconductor Progress
Nestled in the Electronic City Campus of Bangalore, the HSIO Lab stands as a beacon of innovation in semiconductor testing. It brings to the table advanced test methodologies, bench characterization, and access to Keysight’s forefront test solutions. The primary beneficiaries of this development will be customers who can look forward to faster market times, improved product quality, and minimized development costs.
Keysight’s reputation for providing top-tier test and measurement solutions will play a critical role in this partnership. Tessolve plans to harness Keysight’s High-Speed Semiconductor Test Solutions to offer comprehensive support throughout the semiconductor development process. This encompasses everything from early prototyping and development phases to design verification and compliance testing across various Interconnect standards.
Merging Expertise for Optimal Results: Signal Integrity Analysis and Board Design
The essence of this collaboration lies in the merging of Tessolve and Keysight’s expertise to fully leverage the benefits of Signal Integrity (SI) analysis and board design skills. With a focus on pushing the envelope in semiconductor test solutions for high-speed designs, this alliance is tailored to address the needs of the latest specifications of PCIe, USB, DDR, and MIPI.
Voices from the Leadership: A Commitment to Innovation and Quality
Huzefa Cutlerywala and Peng Cao, senior leaders at Tessolve and Keysight respectively, have both highlighted the strategic importance of this collaboration. By establishing the HSIO Lab and investing in cutting-edge test instrumentation, Tessolve is poised to offer state-of-the-art testing solutions for HSIO interfaces like LPDDR/DDR5, USB 4.0, and PCIe Gen 6. This partnership not only underscores a commitment to innovation but also promises to deliver high-speed, reliable, and secure semiconductor technologies to the global market.
