The Arizona Commerce Authority (ACA) has recently disclosed a significant investment of $17.5 million in Arizona State University (ASU), contributing to the larger $100 million state funding initiative aimed at advancing semiconductor development in the region. This substantial funding is expected to play a pivotal role in expanding Arizona’s capabilities in advanced semiconductor manufacturing, particularly in the realm of fan-out wafer-level packaging research and development (R&D).
Empowering Arizona’s Semiconductor Industry
The investment will enable ASU to enhance its MacroTechnology Works (MTW) facility in Tempe through the acquisition of state-of-the-art equipment. ASU’s strategic plan involves extending its research into advanced packaging and gallium nitride (GaN) technologies, with a particular focus on applications such as 6G, the Internet of Things (IoT), and machine learning. Moreover, the funds will support workforce development initiatives, including internships, joint research programs, and the exploration of next-generation GaN R&D for 6G technologies in collaboration with industry partner NXP Semiconductors N.V. based in Chandler, AZ.
Governor’s Perspective on Semiconductor Ecosystem Growth
Arizona Governor Katie Hobbs emphasizes the importance of ASU’s MacroTechnology Works expansion in strengthening the state’s semiconductor ecosystem. She believes that the new capabilities will provide unique training and R&D opportunities, reinforcing Arizona’s workforce and supporting sustained industry growth.
ASU’s Commitment to Semiconductor Advancements
ASU President Michael Crow expresses the university’s commitment to advancing domestic semiconductor manufacturing, research, and development. ASU has recently established a Microelectronics Workforce Development Hub and strategically focused on the MacroTechnology Works facility to align with the objectives outlined in the funding announcement.
Collaborative Innovation for 6G
The partnership between ASU and NXP Semiconductors is viewed as a crucial step towards driving innovation in 6G. Jim Norling, VP of Product Management at NXP Semiconductors, emphasizes the collaborative effort’s potential to contribute to the development of critical communications infrastructure benefiting both Arizona and the entire United States.
Arizona’s Continued Semiconductor Commitment
ACA President & CEO Sandra Watson underscores Arizona’s ongoing commitment to advancing the semiconductor industry. The investment in ASU is seen as a means to expand the state’s semiconductor supply chain and workforce development efforts while building on strategic initiatives to establish an advanced packaging ecosystem.
Building on Previous Initiatives
The $17.5 million investment at ASU is part of a broader $100 million commitment announced last year to boost semiconductor and microelectronics development in Arizona. Previous collaborations, such as the Materials-to-Fab (MTF) Center and the Micro/Nano Fabrication Center (MNFC), highlight the state’s dedication to shared research and development facilities, complementing federal investments through initiatives like the CHIPS and Science Act.
Arizona’s Position in the Department of Defense Program
In September, Arizona was selected as one of eight regional hubs in the Department of Defense Microelectronics Commons program. Led by ASU, the Southwest Advanced Prototyping (SWAP) Hub was awarded $39.8 million to advance microelectronics R&D, focusing on artificial intelligence hardware, 5G/6G, and Commercial Leap Ahead Technologies. The SWAP Hub aims to create a GaN and advanced packaging ecosystem in Arizona with lab-to-fab capabilities.
Conclusion:
Arizona’s strategic investments and partnerships, particularly with ASU, are propelling the state to the forefront of semiconductor development, fostering innovation and growth in the industry.
