The latest breakthrough in thermal management comes from Vishay’s cutting-edge ThermaWick THJP Series of Surface-mount Thermal Jumper Chips. These remarkable devices revolutionize heat dissipation for electrically isolated components by establishing a thermally conductive bridge to a ground plane or common heatsink, all while preserving the essential electrical isolation of each component.
Designed by Vishay Dale Thin Film, this ingenious solution is built upon an aluminum nitride substrate boasting an impressive thermal conductivity of 170 W/m°K. By seamlessly channeling heat away, these chips have the capacity to significantly reduce the temperature of connected components by an impressive margin, surpassing 25%. This crucial advancement empowers designers to augment the power handling capabilities of these components, thus prolonging their operational lifespan under existing conditions while preserving vital electrical isolation. Moreover, this meticulous thermal management prevents adjacent devices from being affected by thermal stress, thereby elevating overall circuit reliability to new heights.
One of the standout features of the Vishay THJP Series is its remarkably low capacitance, which can plunge as low as 0.07 pF. This attribute renders it particularly suitable for applications demanding high frequency and thermal ladder functionalities. These versatile thermal conductors find their niche in an array of applications, spanning power supplies, converters, RF amplifiers, synthesisers, pin and laser diodes, as well as filters in sectors such as AMS, industrial, and telecommunications.
The Thermal Jumper Chip is available in six distinct case sizes, ranging from the compact 0603 to the larger 2512, with options for custom sizes. Notably, the 0612 and 1225 cases are equipped with elongated side terminations, augmenting their heat dissipation potential. For seamless integration, this thermal jumper is offered with both lead (Pb) bearing and lead (Pb) free wraparound terminations, catering to diverse requirements.
These RoHS-compliant marvels feature aluminum nitride substrates, and they are available in both SnPb and Pb-free wraparound termination styles. Their minimal capacitance makes them a prime candidate for applications necessitating high frequency and thermal ladder functionalities. Additionally, the chips offer an extensive array of connection options, including component-to-heat sink, component-to-case, component-to-ground plane, pad-to-pad, pad-to-via, and pad-to-trace configurations.
Key Features & Benefits:
- Facilitates electrically isolated thermal conduction
- Utilizes high thermal conductivity AlN substrate (170 W/mK)
- Ensures electrical isolation with terminations exceeding 999 MΩ
- Exhibits impressively low capacitance
- Available with both SnPb and lead (Pb)-free wrap terminations
- Compliant with RoHS standards
Applications:
- Power supplies and converters
- RF amplifiers
- Synthesisers
- Switch mode power supplies
- Pin and laser diodes
- Filters
In the dynamic landscape of modern electronics, Vishay’s ThermaWick THJP Series stands as a testament to innovation, reshaping the realm of thermal management and propelling the potential of electrically isolated components to unprecedented heights.
